Electronics Enclosure Mounting

ABSTRACT

A system for magnetically securing an electronics enclosure proximate a surface of a separate structure. The system includes a mounting apparatus that has a first surface, a second surface, and an interface structure that is constructed and arranged to allow the mounting apparatus to be secured to the surface of the separate structure, with the first surface of the mounting apparatus closer to the surface of the separate structure than is the second surface of the mounting apparatus. One or more magnets are fixed to one or both of the mounting apparatus and the electronics enclosure such that the one or more magnets are arranged to magnetically couple the electronics enclosure to the mounting apparatus.

BACKGROUND

This disclosure relates to an apparatus that is used to mount anelectronics enclosure to a separate structure.

Electronics enclosures, such as audio or video network interfacedevices, are sometimes permanently mounted to an underside surface suchas the underside of a conference room table. Installers typically needto crawl under the table and screw the device to the underside of thetable. The installer must also connect to the interface device wiresfrom devices such as microphones on top of the table, and devices andconnection points under the table. These tasks are awkward and difficultand time consuming to accomplish. Also, the installer can damage thetable during installation. If the device later needs to be removed orreplaced, the same issues exist.

SUMMARY

All examples and features mentioned below can be combined in anytechnically possible way.

In one aspect, a system for magnetically securing an electronicsenclosure that has a first surface proximate a surface of a separatestructure, includes a mounting apparatus that has a first surface, asecond surface, and an interface structure that is constructed andarranged to allow the mounting apparatus to be secured to the surface ofthe separate structure, with the first surface of the mounting apparatuscloser to the surface of the separate structure than is the secondsurface of the mounting apparatus. One or more magnets are fixed at oneor both of the second surface of the mounting apparatus and the firstsurface of the electronics enclosure, such that one or more of themagnets are arranged to magnetically couple the electronics enclosure tothe mounting apparatus.

Embodiments may include one of the following features, or anycombination thereof. The mounting apparatus may further include at leastone magnet retention feature in the second surface of the mountingapparatus, each magnet retention feature structured for retaining amagnet fixed to the mounting apparatus. The at least one magnetretention feature may comprise a depression in the second surface of themounting apparatus. The depression may be constructed and arranged suchthat a magnet that is located in the depression has an external surfacethat is at or above the second surface of the mounting apparatus. Themounting apparatus may comprise a plurality of spaced magnet-retentiondepressions in its second surface, wherein each depression isconstructed and arranged such that a magnet that is retained in thedepression has an external surface that is at or above the secondsurface of the mounting apparatus. The interface structure that isconstructed and arranged to allow the mounting apparatus to be securedto the surface of the separate structure, with the first surface of themounting apparatus closer to the surface of the separate structure thanis the second surface of the mounting apparatus, may comprise aplurality of spaced apertures extending between the first and secondsurfaces of the mounting apparatus, each of the apertures structured toaccept a fastener.

Embodiments may include one of the above and/or below features, or anycombination thereof. The mounting apparatus may also include at leastone secondary securing feature, where each secondary securing feature isconstructed and arranged to mechanically secure the electronicsenclosure to the mounting apparatus. The secondary securing feature maycomprise a mechanical securing structure that is arranged to be fixed toboth the electronics enclosure and the mounting apparatus. The secondsurface of the mounting apparatus may comprise an electronics enclosureinterface structure that is structured to engage with a portion of theelectronics enclosure. The electronics enclosure interface structure mayhave two opposed sides. The mounting apparatus may further comprise twospaced sets of spaced apertures extending between the first and secondsurfaces of the mounting apparatus, each of the apertures structured toaccept a fastener for fastening a mechanical securing structure to thesecond surface of the mounting apparatus. There may be one set of spacedapertures proximate each opposed side of the electronics enclosureinterface structure. The apertures in each set may be aligned along anaxis, and the axes for the two sets may be generally parallel.

Embodiments may include one of the above and/or below features, or anycombination thereof. The mounting apparatus may further comprise spacedelectronics enclosure alignment features that are structured to engagewith the electronics enclosure so as to accomplish a predefinedorientation and alignment of the electronics enclosure on the mountingapparatus. The spaced electronics enclosure alignment features may eachcomprise a tab projecting from the second surface of the mountingapparatus, each tab constructed and arranged to fit into a slot in theelectronics enclosure.

Embodiments may include one of the above and/or below features, or anycombination thereof. The mounting apparatus may further comprise atleast one cable support feature that is structured to directly, orindirectly, support a cable. The cable support feature may comprise araised structure that extends above the second surface of the mountingapparatus. The second surface of the mounting apparatus may comprise anelectronics enclosure interface structure that is structured to engagewith a portion of the electronics enclosure. The electronics enclosureinterface structure may have two opposed sides. The cable supportfeature may comprise two spaced sets of raised structures that extendabove the second surface of the mounting apparatus. There may be one setof raised structures proximate each opposed side of the electronicsenclosure interface structure.

In another aspect, a system for securing an electronics enclosureproximate a surface of a separate structure, includes a mountingapparatus comprising a first surface, a second surface, and an interfacestructure that is constructed and arranged to allow the mountingapparatus to be secured to the surface of the separate structure, withthe first surface of the mounting apparatus closer to the surface of theseparate structure than is the second surface of the mounting apparatus,and at least one cable support feature that is structured to directly,or indirectly, support a cable, wherein the at least one cable supportfeature comprises a raised structure that extends above the secondsurface of the mounting apparatus. The second surface of the mountingapparatus may comprise an electronics enclosure interface structure thatis structured to engage with a portion of the electronics enclosure. Theelectronics enclosure interface structure may have two opposed sides.The cable support feature may comprise two spaced sets of raisedstructures that extend above the second surface of the mountingapparatus. There may be one set of raised structures proximate eachopposed side of the electronics enclosure interface structure.

In another aspect, a system for securing an electronics enclosureproximate a surface of a separate structure, includes a mountingapparatus comprising a first surface, a second surface, and an interfacestructure that is constructed and arranged to allow the mountingapparatus to be secured to the surface of the separate structure, withthe first surface of the mounting apparatus closer to the surface of theseparate structure than is the second surface of the mounting apparatus,and at least one secondary securing feature, where each secondarysecuring feature is constructed and arranged to mechanically secure theelectronics enclosure to the mounting apparatus.

Embodiments may include one of the above and/or below features, or anycombination thereof. The secondary securing feature may comprise amechanical securing structure that is adapted to be fixed to both theelectronics enclosure and the mounting apparatus. The second surface ofthe mounting apparatus may comprise an electronics enclosure interfacestructure that is structured to engage with a portion of the electronicsenclosure. The electronics enclosure interface structure may have twoopposed sides. The mounting apparatus may further comprise two spacedsets of spaced apertures extending between the first and second surfacesof the mounting apparatus, each of the apertures structured to accept afastener for fastening a mechanical securing structure to the secondsurface of the mounting apparatus. There may be one set of spacedapertures proximate each opposed side of the electronics enclosureinterface structure. The apertures in each set may be aligned along anaxis, and the axes for the two sets may be generally parallel.

In another aspect. a system for securing an electronics enclosureproximate a surface of a separate structure, includes a mountingapparatus comprising a first surface, a second surface, and an interfacestructure that is constructed and arranged to allow the mountingapparatus to be secured to the surface of the separate structure, withthe first surface of the mounting apparatus closer to the surface of theseparate structure than is the second surface of the mounting apparatus,and spaced electronics enclosure alignment features that are structuredto engage with the electronics enclosure so as to accomplish apredefined orientation and alignment of the electronics enclosure on themounting apparatus. The spaced electronics enclosure alignment featuresmay each comprise a tab projecting from the second surface of themounting apparatus, each tab constructed and arranged to fit into a slotin the electronics enclosure.

In another aspect, an assembly includes a mounting apparatus comprisinga first surface, a second surface, and an interface structure that isconstructed and arranged to allow the mounting apparatus to be securedto the surface of the separate structure, with the first surface of themounting apparatus closer to the surface of the separate structure thanis the second surface of the mounting apparatus. There is an electronicsenclosure with a first surface. One or more magnets are fixed to one orboth of the second surface of the mounting apparatus and the firstsurface of the electronics enclosure. The first surface of theelectronics enclosure is constructed and arranged to be magneticallysecured to the second surface of the mounting apparatus by magneticattraction.

Embodiments may include one of the above and/or below features, or anycombination thereof. The mounting apparatus may further comprise atleast one magnet retention feature in the second surface of the mountingapparatus, each magnet retention feature structured for retaining amagnet fixed to the mounting apparatus, wherein the at least one magnetretention feature comprises a depression in the second surface of themounting apparatus. The mounting apparatus may further comprise spacedelectronics enclosure alignment features that are structured to engagewith the electronics enclosure so as to accomplish a predefinedorientation and alignment of the electronics enclosure on the mountingapparatus. The spaced electronics enclosure alignment features may eachcomprise a tab projecting from the second surface of the mountingapparatus, each tab constructed and arranged to fit into a slot in theelectronics enclosure.

Embodiments may include one of the above and/or below features, or anycombination thereof. The assembly may include at least one secondarysecuring feature, which may be constructed and arranged to mechanicallysecure the electronics enclosure to the mounting apparatus. Thesecondary securing feature may comprise a mechanical securing structurethat is structured to be fixed to both the electronics enclosure and themounting apparatus. The second surface of the mounting apparatus maycomprise an electronics enclosure interface structure that is structuredto engage with a portion of the electronics enclosure. The electronicsenclosure interface structure may have two opposed sides. The mountingapparatus may further comprise two spaced sets of spaced aperturesextending between the first and second surfaces of the mountingapparatus, each of the apertures structured to accept a fastener forfastening a mechanical securing structure to the second surface of themounting apparatus. There may be one set of spaced apertures proximateeach opposed side of the electronics enclosure interface structure. Theapertures in each set may be aligned along an axis, and the axes for thetwo sets may be generally parallel.

Embodiments may include one of the above and/or below features, or anycombination thereof. The mounting apparatus may further comprise atleast one cable support feature that is structured to directly, orindirectly, support a cable. The at least one cable support feature maycomprise a raised structure that extends above the second surface of themounting apparatus. The second surface of the mounting apparatus maycomprise an electronics enclosure interface structure that is structuredto engage with a portion of the electronics enclosure. The electronicsenclosure interface structure may have two opposed sides. The cablesupport features may comprise two spaced sets of raised structures thatextend above the second surface of the mounting apparatus. There may beone set of raised structures proximate each opposed side of theelectronics enclosure interface structure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of an electronics enclosure mountingapparatus.

FIG. 2 is a side view of the electronics enclosure mounting apparatus ofFIG. 1.

FIG. 3 is an end view of the electronics enclosure mounting apparatus ofFIG. 1.

FIG. 4 is a perspective view of an electronics enclosure that can bemounted to a separate structure, with the mounting apparatus of FIG. 1.

FIG. 5 is a perspective view of an assembly that includes theelectronics enclosure mounting apparatus of FIG. 1.

FIG. 6 is an exploded view of the assembly of FIG. 5.

FIG. 7 is a perspective view of the assembly of FIG. 5 with a cablecoupled to the electronics enclosure.

FIG. 8 is a side view of the assembly of FIG. 7, mounted to theunderside of a table.

FIG. 9 is a perspective view of another electronics enclosure mountingapparatus.

DETAILED DESCRIPTION

Electronics enclosures, such as those that house audio or video networkinterface devices and other electronic or electrical devices that areused for room audio, video and/or conferencing, are sometimes mounted tothe underside of conference room tables. Installers typically need tocrawl under the table and screw the device to the underside of thetable. The installer must also connect to the interface device wiresfrom other devices, such as microphones on top of the table, and devicesand connection points under the table. During installation, many timesthe device will need to be secured and removed multiple times. All thesetasks are awkward, difficult, and time consuming to accomplish. Also,the installer can damage the table during installation. If the devicelater needs to be removed or replaced, the same issues exist.

The present electronics enclosure mounting apparatus is arranged to holdan electronics enclosure such as an audio network interface device tothe underside of a table, cabinet, or shelf (or, to hold it to anothertype separate structure such as another piece of furniture, or a wall orpartition, for example, and/or a location other than the underside ofthe separate structure) with magnets. The magnets are coupled to one orboth of a magnet carrier that is attached to the underside of the table,and the electronics enclosure. The magnetic coupling of the electronicsenclosure to the table allows the enclosure to be coupled to the tablesimply by aligning the enclosure with the magnet carrier. Theelectronics enclosure can also be easily removed and replaced, allwithout the need for any tools.

The magnet carrier may comprise a mounting apparatus that is adapted tobe secured to the underside of a table or desk, or to any part ofanother type of separate structure. One or more magnets can be coupledto the mounting apparatus such that the magnets are held just below thetable, preferably with their surfaces exposed. A ferromagnetic portionof an electronic enclosure can then be coupled directly to the magnets.The enclosure will thus be magnetically and removably held under thetable, with no tools needed to install or remove the enclosure fromunder the table.

In one aspect, and as best shown in FIGS. 1-3, the present disclosureincludes an electronics enclosure mounting apparatus 10 for removablysecuring, proximate a surface of a separate structure, an electronicsenclosure that is made at least in part from a ferromagnetic material.Mounting apparatus 10 can be made from sheet metal that is formed, e.g.,by stamping. Mounting apparatus 10 includes a platform 12 that has afirst surface 16, and a second surface 14. An interface structure 13 isconstructed and arranged to allow the platform 12 to be secured to thesurface of the separate structure, with the first surface 16 of theplatform 12 closer to the surface of the separate structure than is thesecond surface 14 of the platform 12. See FIG. 8, which showselectronics enclosure 60 mounted by apparatus 10 to the underside 54 ofconference room table 52. A magnet 24 is fixed to the platform 12 suchthat the magnet 24 is exposed at the second surface 14 of the platform12. As shown in FIGS. 5, 7, and 8 and further described below, anelectronics enclosure 60 can be reliably secured to the separatestructure by magnetically coupling the electronics enclosure (via aferromagnetic portion of the electronics enclosure) to the magnet(s) ofthe mounting apparatus. Alternatively, the magnets could be mounted tothe electronics enclosure and the mounting apparatus could be made fromor include ferromagnetic material. Or, there could be magnets fixed toboth devices. Magnetic securing of the mounting apparatus and theelectronics enclosure allows the electronics enclosure to be removedfrom, and replaced to, its mounting location without the need for anytools.

There may also be at least one magnet retention feature in the secondsurface 14 of the platform 12. Each magnet retention feature isstructured for retaining a magnet that is fixed to the platform 12. Inthe illustrated, non-limiting examples, the magnet retention featurecomprises a depression 31 in the second surface 14 of the platform 12.The depression 31 may be constructed and arranged such that a magnet 24that is located in the depression and fixed to the mounting apparatus(e.g., using an appropriate adhesive, or fixed by some other mechanicalmeans, such as a cavity or pocket or tabs in surface 14 that retains themagnet) has an external surface 35 that is just below, or, morepreferably, at, or just slightly above, the second surface 14 of theplatform 12. In order to provide for securing of electronics enclosureswith more weight, and/or to hold the electronics enclosure moresecurely, the platform may carry a plurality of magnets. In the presentexample depicted in FIG. 1, there are four spaced magnets 24, 25, 26,and 27, each fixed to the mounting apparatus in a depression 31, 32, 33,and 34, respectively. Each depression is preferably constructed andarranged such that a magnet that is located in the depression has anexternal surface that is located close to, at, or just above the secondsurface of the platform.

Other arrangements of one or more magnets are contemplated herein. Forexample, the magnets could be carried directly on surface 14. Or, themagnets could be on the electronics enclosure, or one or more magnetscould be on each of the mounting apparatus and the electronicsenclosure. While electronic devices with ferrous metal enclosures arecommon, some audio or video devices typically mounted to a surface mayinclude non-ferrous metal enclosures such as aluminum, or non-metalenclosures such as plastic. In this event, the device to be mounted tothe mounting apparatus could be designed to include an embedded,inexpensive, ferrous metal plate in the area of the mounting apparatusmagnetic engagement. Alternatively, the magnets could be included in theelectronic device to be mounted, rather than in the mounting apparatusif the mounting apparatus surface itself is ferrous metal. As anotheralternative, the magnets could be in both the mounting apparatus and theelectronic device to be mounted, with care taken to ensure polarity ofthe magnets in the two-part system attract, rather than repel. Magnetscome in a variety of materials, strengths, sizes, and shapes. The typesand quantity of magnets can be selected to provide theattraction/retention force necessary for the particular application.Preferably, the magnets are small, high-strength permanent magnets,which are known in the art; such magnets include but are not limited torare-earth magnets.

An interface structure 13 is constructed and arranged to allow theplatform 12 to be secured to the surface of the separate structure.Interface structure 13 may comprise a plurality of spaced apertures35-42, each of which extends through the thickness of platform 12,between its first 16 and second 14 surfaces. Each of these apertures arestructured to accept a fastener, such as a screw. In this non-limitingexample, screws 47-50 are received in apertures 35-38, located near thecorners of the platform. See FIG. 6. The interior apertures 39-42provide additional or alternative securing locations.

Mounting apparatus 10 also preferably but not necessarily includes atleast one secondary securing feature, where each secondary securingfeature is constructed and arranged to mechanically secure theelectronics enclosure to the platform. While the primary securingfeature, magnetic bond, has desirable characteristics, namely easyapplication and removability of the electronics enclosure, there may beapplications where environmental forces, for example vibration, sheer orshock forces, that could cause the primary securing feature to fail,should be accommodated. The secondary securing feature provides anoptional, mechanical securing method which can be used in this type ofenvironment. The secondary securing features in this non-limitingexample take the form of mechanical securing structures, such as smallbrackets, that are structured to be fixed to both the electronicsenclosure and the platform. The second surface of the platform mayinclude one or more apertures or other mechanical features that allow abracket to be coupled to the platform. The electronics enclosure canalso include one or more apertures or other mechanical features locatedsuch that one or more brackets can be secured to the electronicsenclosure and the platform. The secondary securing features can takemany other possible forms, where the securing features are adapted tomechanically secure the electronics enclosure to the mounting apparatus.For example, hinged tabs or spring-barb combinations provide mechanicalretention and tool-less removal.

In one non-limiting example, platform 12 includes an electronicsenclosure interface structure 70 (e.g., a slightly raised pedestal, asshown in FIG. 1) that is structured to engage with a portion of theelectronics enclosure that comprises ferromagnetic material. In thepresent non-limiting example, ferromagnetic portion 72 (see FIG. 4) ofelectronics enclosure 60 is structured such that it fits on and will lieflat on (or, perhaps, just off of if the magnets themselves make directcontact) interface structure 70 of platform 12. Portion 72 can be aferromagnetic (e.g., steel) exterior wall of the enclosure. Theelectronics enclosure interface structure 70 has two opposed sides, 18and 19. The platform 12 includes two spaced sets of spaced aperturesextending between the first and second surfaces of the platform, each ofthe apertures structured to accept a fastener for fastening a bracket tothe second surface of the platform. Aperture set 78 includes threeclosely-spaced apertures that lie along axis 84, which can lie close toside 18. Aperture set 80 includes three closely-spaced apertures (one,aperture 81, numbered), that lie along axis 85, which can lie close toside 19. Axes 84 and 85 are preferably parallel, or close to (i.e.,generally) parallel.

Aperture sets 78 and 80 are arranged to allow the use of brackets 62, 65as secondary securing features, with electronic enclosures havingdifferent widths. An assembly of electronic enclosure 60 and mountingapparatus 10, is shown in FIG. 5. Surface 72 of enclosure 60 (see FIG.4) sits on interface structure 70. Enclosure 60 has exposed outsidesurface 61, and end-face 63 that carries one or more electricalcontacts, collectively labelled as electrical connector set 64. Aperture66 is located on face 63 near connector set 64. “L”-shaped bracket 62 isconnected to face 63 via screw 83 that is accepted into threadedaperture 66. Bracket 62 is also connected to interface structure 70 viascrew 82 that is accepted into threaded aperture 81. A second bracket65, FIG. 6, can be used in the same fashion on the opposed face ofenclosure 60 and one aperture of set 78. The other apertures of sets 78and 80 allow this same coupling to occur with electronic enclosures thatare narrower than enclosure 60. Apparatus 10 is thus designed to be usedwith electronics enclosures of three different widths. Alternatively,there could be only one, or two, or more than three, apertures in eachset 78 and 80. There could also be only one set of apertures, or morethan two sets of apertures. Also, the apertures need not be in sets.Also, mechanical coupling could be accomplished with a single bracket;two are used to help ensure that enclosure 60 cannot decouple frommounting apparatus 10 should there be any problem with the primary(magnetic) coupling.

Platform 12 also preferably but not necessarily includes spacedelectronics enclosure alignment features that are structured to engagewith the electronics enclosure so as to accomplish a predefinedorientation and alignment of the electronics enclosure on the platform.The spaced electronics enclosure alignment features may comprise tabs 90and 92 that project from the second surface 14 of the platform 12. Tabs90 and 92 are each located, constructed, and arranged to fit into a slotin the electronics enclosure, as is further explained below. Additionalalignment tabs could be used to ensure that the electronics enclosure isproperly installed on the mounting apparatus. Such tabs could preventmagnetic engagement until the electronics enclosure was properlyoriented.

Platform 12 also preferably includes at least one cable support featurethat is structured to directly, or indirectly, support a cable againstmovement or possible disengagement caused by either vertical forces(gravity) or lateral forces (pulling of the cable). The cable supportfeature may comprise a raised structure that extends above the secondsurface of the platform. In one present non-limiting example, ends 20and 21 of platform 12 each include three raised structures, 105-107 and102-104, respectively, located close to the ends, outside of interfacestructure 70. These raised structures serve as platforms/features thatcan directly support a cable, or indirectly support a cable. Directsupport can be accomplished by actual physical contact of a cable with acable support feature, for example using a spring-type clip or the like.One example of such a direct support/retention feature could be a“C”-shaped clip or snap feature on the platform, whereby the ‘C’ is madefrom pliable metal and approximates the diameter of the cable. The cableis then forced into the opening, expanding the opening of the feature,followed by the pliant metal returning to original size thus retainingthe cable in the center of the ‘C’ (not shown). Another example could bea spring-type “L”-shaped feature, whereby the cable is forced under theprotruding L, and the spring nature of the metal retains the cable inplace (not shown.)

Indirect cable support may be accomplished by coupling the cable to acable support feature with another tying structure, such as a cable tie.FIGS. 7 and 8 depict cable 130 with connector 132 coupled to a connectorof connector set 64 of enclosure 60. Cable tie 140 encircles cable 130and raised cable support feature 102, so as to indirectly couple thecable to the raised cable support feature and, thus, to the platform.The size, shape, location, and quantity of raised cable support featuresthat can act to support a cable is not limited, the examples depicted inthe figures merely serving to illustrate the concept. A second exampleis illustrated in FIG. 9, where platform 181 has electronics enclosureinterface structure 182 that carries magnets 184 and 186. Platform 181has three raised cable support features, such as structure 188, that areturned 180 degrees in orientation relative to the cable support featuresshown in FIG. 1.

A typical use situation is as follows. Mounting apparatus 10 is securedto the underside 54 of table 52 via screws 47-50. Side 72 of electronicsenclosure 60 is then placed against interface structure 70. Magnets24-27 hold enclosure 60 against apparatus 10. Brackets 62 and 65 canthen be installed, if desired. Appropriate coupling and securing of anycables can then be accomplished. An example of an installed assembly 73comprising mounting apparatus 10 and coupled electronic enclosure 60,with secured cable 130, is shown in FIG. 8. Enclosure 60 can be removedsimply by pulling down with sufficient force to disengage side 72 frommagnets 24-27; brackets 62 and 65 would need to be removed first if theyare used.

The mounting apparatus and the electronics enclosure can have structuresthat facilitate proper alignment of the two. This helps to simplifyunder-table mounting, where visualization of the necessary alignment canbe difficult. The electronics enclosure can thus be mounted by feel.This alignment structure can include tabs 90 and 92 that project fromsurface 14 of apparatus 10, and are constructed and arranged to fit intoslots 94 and 96 in enclosure 60. See FIG. 4. Tabs 90 and 92 also serve aretention purpose, in addition to guiding and positioning. The magnetswill hold the electronics enclosure in place against forces that arenormal to the surface of the mounting apparatus, but may not be aseffective against forces in the other two directions (the two directionsparallel to surface 14). Tabs 90 and 92 will resist motion of theelectronics enclosure in these two directions; these motions can comeabout when cables are coupled to or removed from the electronicsenclosure. Also, small projecting lips 112, 114, 116, and 118, on ends120 and 122 of enclosure 60, project above surface 72. When enclosure 60is engaged with apparatus 10, these projecting lips extend a littlehigher than interface structure 70. See FIG. 5. Lips 112, 114, 116, and118 thus accomplish a positive seating of enclosure 60 on mountingapparatus 10 when the two are properly aligned, which furtherfacilitates engagement without the need to visualize the engagement, andhelp in retention.

One of myriad possible alternative mounting apparatuses 181 is shown inFIG. 9. Apparatus 181 differs from apparatus 10 in that cable supportfeature 188 is aligned at 180 degrees to the alignment of the cablesupport features on apparatus 10. This can provide a longer shelf towhich a cable can be coupled. Other shapes, sizes, orientations, andlocations of cable support features are contemplated herein. Also,apparatus 181 carries only two magnets 184 and 186. Another possibilitywould be to make the platform from a flat piece of sheet metal, withmagnets protruding above the surface, and potentially also with raisedcable support features. In this case, the alignment tabs 90 and 92 couldbe made a little taller to cause the device to sit off the platform bythe thickness of the magnets.

A number of implementations have been described. Nevertheless, it willbe understood that additional modifications may be made withoutdeparting from the scope of the inventive concepts described herein,and, accordingly, other embodiments are within the scope of thefollowing claims.

What is claimed is:
 1. A system for magnetically securing an electronicsenclosure that has a first surface, proximate a surface of a separatestructure, comprising: a mounting apparatus comprising a first surface,a second surface, and an interface structure that is constructed andarranged to allow the mounting apparatus to be secured to the surface ofthe separate structure, with the first surface of the mounting apparatuscloser to the surface of the separate structure than is the secondsurface of the mounting apparatus; and one or more magnets fixed at oneor both of the second surface of the mounting apparatus and the firstsurface of the electronics enclosure, such that the one or more magnetsare arranged to magnetically couple the electronics enclosure to themounting apparatus.
 2. The system of claim 1, wherein the mountingapparatus further comprises at least one magnet retention feature in thesecond surface of the mounting apparatus, each magnet retention featurestructured for retaining a magnet fixed to the mounting apparatus. 3.The system of claim 1, wherein the at least one magnet retention featurecomprises a depression in the second surface of the mounting apparatus.4. The system of claim 3, wherein the depression is constructed andarranged such that a magnet that is located in the depression has anexternal surface that is at or above the second surface of the mountingapparatus.
 5. The system of claim 4, wherein the mounting apparatuscomprises a plurality of spaced magnet-retention depressions in itssecond surface, wherein each depression is constructed and arranged suchthat a magnet that is retained in the depression has an external surfacethat is at or above the second surface of the mounting apparatus.
 6. Thesystem of claim 1, wherein the interface structure that is constructedand arranged to allow the mounting apparatus to be secured to thesurface of the separate structure, with the first surface of themounting apparatus closer to the surface of the separate structure thanis the second surface of the mounting apparatus, comprises a pluralityof spaced apertures extending between the first and second surfaces ofthe mounting apparatus, each of the apertures structured to accept afastener.
 7. The system of claim 1, further comprising at least onesecondary securing feature, where each secondary securing feature isconstructed and arranged to mechanically secure the electronicsenclosure to the mounting apparatus.
 8. The system of claim 7, whereinthe secondary securing feature comprises a mechanical securing structurethat is arranged to be fixed to both the electronics enclosure and themounting apparatus.
 9. The system of claim 8, wherein: the secondsurface of the mounting apparatus comprises an electronics enclosureinterface structure that is structured to engage with a portion of theelectronics enclosure; the electronics enclosure interface structure hastwo opposed sides; the mounting apparatus further comprises two spacedsets of spaced apertures extending between the first and second surfacesof the mounting apparatus, each of the apertures structured to accept afastener for fastening a mechanical securing structure to the secondsurface of the mounting apparatus; there is one set of spaced aperturesproximate each opposed side of the electronics enclosure interfacestructure; and the apertures in each set are aligned along an axis, andwherein the axes for the two sets are generally parallel.
 10. The systemof claim 1, wherein the mounting apparatus further comprises spacedelectronics enclosure alignment features that are structured to engagewith the electronics enclosure so as to accomplish a predefinedorientation and alignment of the electronics enclosure on the mountingapparatus.
 11. The system of claim 10, wherein the spaced electronicsenclosure alignment features each comprise a tab projecting from thesecond surface of the mounting apparatus, each tab constructed andarranged to fit into a slot in the electronics enclosure.
 12. The systemof claim 1, wherein the mounting apparatus further comprises at leastone cable support feature that is structured to directly, or indirectly,support a cable.
 13. The system of claim 12, wherein the at least onecable support feature comprises a raised structure that extends abovethe second surface of the mounting apparatus.
 14. The system of claim13, wherein: the second surface of the mounting apparatus comprises anelectronics enclosure interface structure that is structured to engagewith a portion of the electronics enclosure; the electronics enclosureinterface structure has two opposed sides; the at least one cablesupport feature comprises two spaced sets of raised structures thatextend above the second surface of the mounting apparatus; and there isone set of raised structures proximate each opposed side of theelectronics enclosure interface structure.
 15. A system for securing anelectronics enclosure proximate a surface of a separate structure,comprising: a mounting apparatus comprising a first surface, a secondsurface, and an interface structure that is constructed and arranged toallow the mounting apparatus to be secured to the surface of theseparate structure, with the first surface of the mounting apparatuscloser to the surface of the separate structure than is the secondsurface of the mounting apparatus; and at least one cable supportfeature that is structured to directly, or indirectly, support a cable,wherein the at least one cable support feature comprises a raisedstructure that extends above the second surface of the mountingapparatus.
 16. The system of claim 15, wherein: the second surface ofthe mounting apparatus comprises an electronics enclosure interfacestructure that is structured to engage with a portion of the electronicsenclosure; the electronics enclosure interface structure has two opposedsides; the at least one cable support feature comprises two spaced setsof raised structures that extend above the second surface of themounting apparatus; and there is one set of raised structures proximateeach opposed side of the electronics enclosure interface structure. 17.A system for securing an electronics enclosure proximate a surface of aseparate structure, comprising: a mounting apparatus comprising a firstsurface, a second surface, and an interface structure that isconstructed and arranged to allow the mounting apparatus to be securedto the surface of the separate structure, with the first surface of themounting apparatus closer to the surface of the separate structure thanis the second surface of the mounting apparatus; and at least onesecondary securing feature, where each secondary securing feature isconstructed and arranged to mechanically secure the electronicsenclosure to the mounting apparatus.
 18. The system of claim 17, whereinthe secondary securing feature comprises a mechanical securing structurethat is adapted to be fixed to both the electronics enclosure and themounting apparatus.
 19. The system of claim 18, wherein: the secondsurface of the mounting apparatus comprises an electronics enclosureinterface structure that is structured to engage with a portion of theelectronics enclosure; the electronics enclosure interface structure hastwo opposed sides; the mounting apparatus further comprises two spacedsets of spaced apertures extending between the first and second surfacesof the mounting apparatus, each of the apertures structured to accept afastener for fastening a mechanical securing structure to the secondsurface of the mounting apparatus; there is one set of spaced aperturesproximate each opposed side of the electronics enclosure interfacestructure; and the apertures in each set are aligned along an axis, andwherein the axes for the two sets are generally parallel.
 20. A systemfor securing an electronics enclosure proximate a surface of a separatestructure, comprising: a mounting apparatus comprising a first surface,a second surface, and an interface structure that is constructed andarranged to allow the mounting apparatus to be secured to the surface ofthe separate structure, with the first surface of the mounting apparatuscloser to the surface of the separate structure than is the secondsurface of the mounting apparatus; and spaced electronics enclosurealignment features that are structured to engage with the electronicsenclosure so as to accomplish a predefined orientation and alignment ofthe electronics enclosure on the mounting apparatus.
 21. The system ofclaim 20, wherein the spaced electronics enclosure alignment featureseach comprise a tab projecting from the second surface of the mountingapparatus, each tab constructed and arranged to fit into a slot in theelectronics enclosure.
 22. An assembly, comprising: a mounting apparatuscomprising a first surface, a second surface, and an interface structurethat is constructed and arranged to allow the mounting apparatus to besecured to the surface of the separate structure, with the first surfaceof the mounting apparatus closer to the surface of the separatestructure than is the second surface of the mounting apparatus; anelectronics enclosure with a first surface; and one or more magnetsfixed to one or both of the second surface of the mounting apparatus andthe first surface of the electronics enclosure; wherein the firstsurface of the electronics enclosure is constructed and arranged to bemagnetically secured to the second surface of the mounting apparatus bymagnetic attraction.
 23. The assembly of claim 22, wherein the mountingapparatus further comprises at least one magnet retention feature in thesecond surface of the mounting apparatus, each magnet retention featurestructured for retaining a magnet fixed to the mounting apparatus,wherein the at least one magnet retention feature comprises a depressionin the second surface of the mounting apparatus.
 24. The assembly ofclaim 22, further comprising at least one secondary securing feature,wherein: each secondary securing feature is constructed and arranged tosecure the electronics enclosure to the mounting apparatus; thesecondary securing feature comprises a mechanical securing structurethat is adapted to be fixed to both the electronics enclosure and themounting apparatus; the second surface of the mounting apparatuscomprises an electronics enclosure interface structure that isstructured to engage with a portion of the electronics enclosure; theelectronics enclosure interface structure has two opposed sides; themounting apparatus further comprises two spaced sets of spaced aperturesextending between the first and second surfaces of the mountingapparatus, each of the apertures structured to accept a fastener forfastening a mechanical securing structure to the second surface of themounting apparatus; there is one set of spaced apertures proximate eachopposed side of the electronics enclosure interface structure; and theapertures in each set are aligned along an axis, and wherein the axesfor the two sets are generally parallel.
 25. The assembly of claim 22,wherein the mounting apparatus further comprises spaced electronicsenclosure alignment features that are structured to engage with theelectronics enclosure so as to accomplish a predefined orientation andalignment of the electronics enclosure on the mounting apparatus, andwherein the spaced electronics enclosure alignment features eachcomprise a tab projecting from the second surface of the mountingapparatus, each tab constructed and arranged to fit into a slot in theelectronics enclosure.
 26. The assembly of claim 22, wherein: themounting apparatus further comprises at least one cable support featurethat is structured to directly, or indirectly, support a cable; the atleast one cable support feature comprises a raised structure thatextends above the second surface of the mounting apparatus; the secondsurface of the mounting apparatus comprises an electronics enclosureinterface structure that is structured to engage with a portion of theelectronics enclosure; the electronics enclosure interface structure hastwo opposed sides; the at least one cable support feature comprises twospaced sets of raised structures that extend above the second surface ofthe mounting apparatus; and there is one set of raised structuresproximate each opposed side of the electronics enclosure interfacestructure.